Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/73403
Title: Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy
Authors: Zhong, X.L. 
Nai, S.M.L.
Gupta, M. 
Keywords: Composite
Lead-free solder materials
Powder metallurgy
Tensile strength
Issue Date: 2009
Source: Zhong, X.L.,Nai, S.M.L.,Gupta, M. (2009). Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy. The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III 2 : 1016-1020. ScholarBank@NUS Repository.
Abstract: Sn-0.7Cu lead-free solder alloy reinforced with sub-micron size alumina particulates in different volume percentage was synthesized using powder metallurgy technique incorporated with microwave sintering. Following synthesis, the extruded materials were characterized in terms of physical and mechanical properties. The density values of the composite solder materials were found to decrease with an increase in volume percentage of alumina particulates. The results of room temperature tensile test revealed that yield stress and ultimate tensile stress of the composite solder materials improved with the addition of alumina particulates. Particular emphasis is placed to interrelate the effect of volume fraction of sub-micron size alumina particulate added in the Sn-0.7Cu alloy with the physical and tensile properties of the resultant composite solder materials.
Source Title: The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III
URI: http://scholarbank.nus.edu.sg/handle/10635/73403
ISBN: 9781615674237
Appears in Collections:Staff Publications

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