Please use this identifier to cite or link to this item:
|Title:||Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy|
|Authors:||Zhong, X.L. |
Lead-free solder materials
|Source:||Zhong, X.L.,Nai, S.M.L.,Gupta, M. (2009). Effect of sub-micron alumina particulates on the properties of A Sn-0.7Cu lead-free solder alloy. The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III 2 : 1016-1020. ScholarBank@NUS Repository.|
|Abstract:||Sn-0.7Cu lead-free solder alloy reinforced with sub-micron size alumina particulates in different volume percentage was synthesized using powder metallurgy technique incorporated with microwave sintering. Following synthesis, the extruded materials were characterized in terms of physical and mechanical properties. The density values of the composite solder materials were found to decrease with an increase in volume percentage of alumina particulates. The results of room temperature tensile test revealed that yield stress and ultimate tensile stress of the composite solder materials improved with the addition of alumina particulates. Particular emphasis is placed to interrelate the effect of volume fraction of sub-micron size alumina particulate added in the Sn-0.7Cu alloy with the physical and tensile properties of the resultant composite solder materials.|
|Source Title:||The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Dec 9, 2017
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.