Effect of nano-size oxide based reinforcement on the tensile properties of Sn-Ag-Cu solder

Please use this identifier to cite or link to this item: https://doi.org/10.1115/IMECE2008-66904

Title:	Effect of nano-size oxide based reinforcement on the tensile properties of Sn-Ag-Cu solder
Authors:	Nai, S.M.L. Wei, J. Gupta, M.
Issue Date:	2009
Citation:	Nai, S.M.L.,Wei, J.,Gupta, M. (2009). Effect of nano-size oxide based reinforcement on the tensile properties of Sn-Ag-Cu solder. ASME International Mechanical Engineering Congress and Exposition, Proceedings 6 : 1-4. ScholarBank@NUS Repository. https://doi.org/10.1115/IMECE2008-66904
Abstract:	In the present study, using powder metallurgy route, varying volume fraction of ZrO2 stabilized with 8 mol.% of Y2O 3 particulates were incorporated into Sn-3.5Ag-0.7Cu solder to develop nanocomposite solders. The samples were extruded and characterized in terms of microstructural and tensile properties. With the addition of nano length scale reinforcement, the results revealed an improvement in 0.2% yield strength (upto ∼ 39%) and ultimate tensile strength (upto ∼ 43%), when compared with that of monolithic Sn-Ag-Cu solder. An attempt is made in this study to interrelate the tensile behavior of Sn-Ag-Cu with the presence of nano-size reinforcement. Copyright © 2008 by ASME.
Source Title:	ASME International Mechanical Engineering Congress and Exposition, Proceedings
URI:	http://scholarbank.nus.edu.sg/handle/10635/85940
ISBN:	9780791848678
DOI:	10.1115/IMECE2008-66904
Appears in Collections:	Staff Publications

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