Development of lead-free Sn-3.5Ag/SnO 2 nanocomposite solders

Please use this identifier to cite or link to this item: https://doi.org/10.1007/s10854-008-9767-1

Title:	Development of lead-free Sn-3.5Ag/SnO 2 nanocomposite solders
Authors:	Babaghorbani, P. Nai, S.M.L. Gupta, M.
Issue Date:	2009
Citation:	Babaghorbani, P., Nai, S.M.L., Gupta, M. (2009). Development of lead-free Sn-3.5Ag/SnO 2 nanocomposite solders. Journal of Materials Science: Materials in Electronics 20 (6) : 571-576. ScholarBank@NUS Repository. https://doi.org/10.1007/s10854-008-9767-1
Abstract:	In the present study, feasibility of using SnO 2 as reinforcement in Sn-3.5Ag is assessed. Energy-efficient microwave assisted powder metallurgy route was used for synthesis of materials. Characterization results revealed that best combination of hardness and tensile strength was realized with 0.7 vol% of SnO 2 in solder matrix. An attempt is made to correlate mechanical properties of Sn-3.5Ag with the increasing presence of SnO 2 particulates at the nanometer length scale. © Springer Science+Business Media, LLC 2008.
Source Title:	Journal of Materials Science: Materials in Electronics
URI:	http://scholarbank.nus.edu.sg/handle/10635/84992
ISSN:	09574522
DOI:	10.1007/s10854-008-9767-1
Appears in Collections:	Staff Publications

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