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Gong Hao

rp01924

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Full Name
Gong Hao
Variants
Hao, G.
Gong, Hao
Gong, H.
HAO, GONG
GONG, HAO
Gong H.
 
Main Affiliation
 
Faculty
 
Email
msegongh@nus.edu.sg
 

Publications

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Results 1-11 of 11 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
12015A cheap and non-destructive approach to increase coverage/loading of hydrophilic hydroxide on hydrophobic carbon for lightweight and high-performance supercapacitorsZhang, L ; Gong, H 
22016A one step processed advanced interwoven architecture of Ni(OH)2 and Cu nanosheets with ultrahigh supercapacitor performanceShi, D; Zhang, L ; Yin, X ; Huang, T.J; Gong, H 
32016Chemical insights into the roles of nanowire cores on the growth and supercapacitor performances of Ni-Co-O/Ni(OH)2 core/shell electrodesYin, X ; Tang, C ; Zhang, L ; Yu, Z.G; Gong, H 
426-Jun-2001Embedded polysilicon gate MOSFETCHAN, LAP; CHA, CHER LIANG; CHOR, ENG FONG ; HAO, GONG ; LEE, TECK KOON
52016IntroductionGong H. ; Biao Y.; Lee J.H.; Gasiyarov V.R.
616-May-2000Method and apparatus to image metallic patches embedded in a non-metal surfaceCHA, CHER LIANG RANDALL; GONG, HAO ; CHOR, ENG FONG ; CHAN, LAP
727-Mar-2003P-type transparent copper-aluminum-oxide semiconductorGONG, HAO ; WANG, YUE ; HUANG, LEI 
824-Feb-2004P-type transparent copper-aluminum-oxide semiconductorGONG, HAO ; WANG, YUE ; HUANG, LEI 
92019Transparent p-type semiconductors: Copper-based oxides and oxychalcogenidesZhang, N.; Sun, J.; Gong, H. 
109-Mar-2005WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIPLU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN
1127-Nov-2003WAFER LEVEL ELECTROLESS COPPER METALLIZATION AND BUMPING PROCESS, AND PLATING SOLUTIONS FOR SEMICONDUCTOR WAFER AND MICROCHIPLU, HAIJING; GONG, HAO ; WONG, CHEE KHUEN STEPHEN