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https://scholarbank.nus.edu.sg/handle/10635/99465
| Title: | Wafer packing for full mask exposure fabrication | Authors: | Du, D. Lim, A. Wu, C.-T. |
Issue Date: | 2-Apr-1998 | Citation: | Du, D.,Lim, A.,Wu, C.-T. (1998-04-02). Wafer packing for full mask exposure fabrication. Electronics Letters 34 (7) : 659-660. ScholarBank@NUS Repository. | Abstract: | The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective. | Source Title: | Electronics Letters | URI: | http://scholarbank.nus.edu.sg/handle/10635/99465 | ISSN: | 00135194 |
| Appears in Collections: | Staff Publications |
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