Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/99465
Title: Wafer packing for full mask exposure fabrication
Authors: Du, D.
Lim, A. 
Wu, C.-T.
Issue Date: 2-Apr-1998
Source: Du, D.,Lim, A.,Wu, C.-T. (1998-04-02). Wafer packing for full mask exposure fabrication. Electronics Letters 34 (7) : 659-660. ScholarBank@NUS Repository.
Abstract: The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective.
Source Title: Electronics Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/99465
ISSN: 00135194
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

54
checked on Feb 16, 2018

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.