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|Title:||Wafer packing for full mask exposure fabrication|
|Source:||Du, D.,Lim, A.,Wu, C.-T. (1998-04-02). Wafer packing for full mask exposure fabrication. Electronics Letters 34 (7) : 659-660. ScholarBank@NUS Repository.|
|Abstract:||The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective.|
|Source Title:||Electronics Letters|
|Appears in Collections:||Staff Publications|
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