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Title: Wafer packing for full mask exposure fabrication
Authors: Du, D.
Lim, A. 
Wu, C.-T.
Issue Date: 2-Apr-1998
Citation: Du, D.,Lim, A.,Wu, C.-T. (1998-04-02). Wafer packing for full mask exposure fabrication. Electronics Letters 34 (7) : 659-660. ScholarBank@NUS Repository.
Abstract: The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective.
Source Title: Electronics Letters
ISSN: 00135194
Appears in Collections:Staff Publications

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