Please use this identifier to cite or link to this item:
|Title:||Study on SiNx passivated Cu/Ta/SiO2/Si multilayer structure||Authors:||Latt, K.M.
|Issue Date:||1-Oct-2002||Citation:||Latt, K.M., Park, H.S., Seng, H.L., Osipowicz, T., Lee, Y.K. (2002-10-01). Study on SiNx passivated Cu/Ta/SiO2/Si multilayer structure. Journal of Materials Science 37 (19) : 4181-4188. ScholarBank@NUS Repository. https://doi.org/10.1023/A:1020096021514||Abstract:||Silicon nitride (SiNx) thin film layers were deposited on Cu/Ta/SiO2/Si multilayer structures by Plasma Enhanced Chemical Vapor Deposition at the temperature 285°C. The influence of post deposition thermal annealing treatments on the micro-structural, compositional and thermal stability study of SiNx/Cu/Ta/SiO2/Si multilayer structure was studied and compared with unpassivated, Cu/Ta/SiO2/Si multilayer structure. It was found that after SiNx passivation, the formation of Cu2O and Ta2O5 was significantly reduced and the structure becomes more stable than unpassivated one. The reaction between Cu, Ta and O was not found in this SiNx/Cu/Ta/SiO2/Si multiplayer structure but the out diffusion of Ta to the Cu surface was unable to be suppressed. The Ta barrier was observed to fail at temperatures above 750°C due to the formation of TaxNy, at the interface of SiNx/Cu. © 2002 Kluwer Academic Publishers.||Source Title:||Journal of Materials Science||URI:||http://scholarbank.nus.edu.sg/handle/10635/98099||ISSN:||00222461||DOI:||10.1023/A:1020096021514|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Mar 4, 2021
WEB OF SCIENCETM
checked on Feb 24, 2021
checked on Feb 28, 2021
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.