Self-assembled organic thin films on electroplated copper for prevention of corrosion

Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.1763901

Title:	Self-assembled organic thin films on electroplated copper for prevention of corrosion
Authors:	Tan, Y.S. Srinivasan, M.P. Pehkonen, S.O. Chooi, S.Y.M.
Issue Date:	Jul-2004
Citation:	Tan, Y.S., Srinivasan, M.P., Pehkonen, S.O., Chooi, S.Y.M. (2004-07). Self-assembled organic thin films on electroplated copper for prevention of corrosion. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 22 (4) : 1917-1925. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1763901
Abstract:	The formation self-assembled organic thin films formed by adsorption on the surface of copper thin films used in ultralarge-scale integrated circuits was discussed. The inhibition of corrosion of the organic thin films in aerated 0.5 M H2SO4 solutions was analyzed using electrochemical impedance spectroscopy and potentiodynamic polarization techniques. It was found that the presence of the films reduced corrosion by blocking the copper surface from the oxygen dissolved in the acid medium. Result shows that the organized, compact thinner film provides a greater barrier against the transport of corrosive species.
Source Title:	Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
URI:	http://scholarbank.nus.edu.sg/handle/10635/90711
ISSN:	07342101
DOI:	10.1116/1.1763901
Appears in Collections:	Staff Publications

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