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|Title:||Self-assembled organic thin films on electroplated copper for prevention of corrosion||Authors:||Tan, Y.S.
|Issue Date:||Jul-2004||Citation:||Tan, Y.S., Srinivasan, M.P., Pehkonen, S.O., Chooi, S.Y.M. (2004-07). Self-assembled organic thin films on electroplated copper for prevention of corrosion. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 22 (4) : 1917-1925. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1763901||Abstract:||The formation self-assembled organic thin films formed by adsorption on the surface of copper thin films used in ultralarge-scale integrated circuits was discussed. The inhibition of corrosion of the organic thin films in aerated 0.5 M H2SO4 solutions was analyzed using electrochemical impedance spectroscopy and potentiodynamic polarization techniques. It was found that the presence of the films reduced corrosion by blocking the copper surface from the oxygen dissolved in the acid medium. Result shows that the organized, compact thinner film provides a greater barrier against the transport of corrosive species.||Source Title:||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films||URI:||http://scholarbank.nus.edu.sg/handle/10635/90711||ISSN:||07342101||DOI:||10.1116/1.1763901|
|Appears in Collections:||Staff Publications|
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