Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.1763901
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dc.titleSelf-assembled organic thin films on electroplated copper for prevention of corrosion
dc.contributor.authorTan, Y.S.
dc.contributor.authorSrinivasan, M.P.
dc.contributor.authorPehkonen, S.O.
dc.contributor.authorChooi, S.Y.M.
dc.date.accessioned2014-10-09T07:08:17Z
dc.date.available2014-10-09T07:08:17Z
dc.date.issued2004-07
dc.identifier.citationTan, Y.S., Srinivasan, M.P., Pehkonen, S.O., Chooi, S.Y.M. (2004-07). Self-assembled organic thin films on electroplated copper for prevention of corrosion. Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films 22 (4) : 1917-1925. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1763901
dc.identifier.issn07342101
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/90711
dc.description.abstractThe formation self-assembled organic thin films formed by adsorption on the surface of copper thin films used in ultralarge-scale integrated circuits was discussed. The inhibition of corrosion of the organic thin films in aerated 0.5 M H2SO4 solutions was analyzed using electrochemical impedance spectroscopy and potentiodynamic polarization techniques. It was found that the presence of the films reduced corrosion by blocking the copper surface from the oxygen dissolved in the acid medium. Result shows that the organized, compact thinner film provides a greater barrier against the transport of corrosive species.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1116/1.1763901
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentCHEMICAL & BIOMOLECULAR ENGINEERING
dc.description.doi10.1116/1.1763901
dc.description.sourcetitleJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
dc.description.volume22
dc.description.issue4
dc.description.page1917-1925
dc.description.codenJVTAD
dc.identifier.isiut000223322000146
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