Laser-material interaction and its applications in surface Micro/Nanoprocessing

Abstract

How to achieve small heat affected zone (HAZ) is a key issue for high quality laser processing. Ultra-short laser irradiation and hybrid laser processing can lead to precision engineering of difficultly processed substrates, such as drilling of heat sensitive bio-polymer films and singulation/ablation of glass and Si substrates. Laser processing in near field can overcome the optical diffraction limit and push the process resolution down to sub-50 nm. To solve the technical bottleneck of slow laser nanoprocessing, parallel (multi-beam) and maskless laser processing techniques are developed. © 2010 American Institute of Physics.