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Please use this identifier to cite or link to this item: https://doi.org/10.1063/1.3507115
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dc.titleLaser-material interaction and its applications in surface Micro/Nanoprocessing
dc.contributor.authorMinghui, H.
dc.date.accessioned2014-06-19T03:16:01Z
dc.date.available2014-06-19T03:16:01Z
dc.date.issued2010
dc.identifier.citationMinghui, H. (2010). Laser-material interaction and its applications in surface Micro/Nanoprocessing. AIP Conference Proceedings 1278 : 293-302. ScholarBank@NUS Repository. <a href="https://doi.org/10.1063/1.3507115" target="_blank">https://doi.org/10.1063/1.3507115</a>
dc.identifier.isbn9780735408289
dc.identifier.issn0094243X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70770
dc.description.abstractHow to achieve small heat affected zone (HAZ) is a key issue for high quality laser processing. Ultra-short laser irradiation and hybrid laser processing can lead to precision engineering of difficultly processed substrates, such as drilling of heat sensitive bio-polymer films and singulation/ablation of glass and Si substrates. Laser processing in near field can overcome the optical diffraction limit and push the process resolution down to sub-50 nm. To solve the technical bottleneck of slow laser nanoprocessing, parallel (multi-beam) and maskless laser processing techniques are developed. © 2010 American Institute of Physics.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1063/1.3507115
dc.sourceScopus
dc.subjectHeat affected zone
dc.subjectLaser precision engineering
dc.subjectNear field
dc.subjectParallel processing
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1063/1.3507115
dc.description.sourcetitleAIP Conference Proceedings
dc.description.volume1278
dc.description.page293-302
dc.identifier.isiutNOT_IN_WOS
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