Laser singulation of IC packages

Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.456850

Title:	Laser singulation of IC packages
Authors:	An, C. Ye, K. Yuan, Y. Hong, M. Lu, Y.
Keywords:	IC package Laser machining Multi-layer material cutting Multi-scan Singulation
Issue Date:	2002
Citation:	An, C., Ye, K., Yuan, Y., Hong, M., Lu, Y. (2002). Laser singulation of IC packages. Proceedings of SPIE - The International Society for Optical Engineering 4426 : 371-373. ScholarBank@NUS Repository. https://doi.org/10.1117/12.456850
Abstract:	The separation of IC packages from a BGA board is realized by means of laser multi-scan method. The laser used in the study is a double frequency Nd-YAG laser with wavelength of 532 nm. The big problem in the laser processing approach mainly arises from the multi-layer materials of BGA board with copper, polyethylene and epoxy glass fiber, because of their different absorption coefficient to the laser beam and their different heat conductivity. In the experiment approach, the effects of laser parameters, such as wavelength, on the dicing efficiency has been investigated for choosing laser. The influence of sample side for laser incidence on cut profile and, the influence of the focused extent of laser beam on singulation speed are discussed. The experimental results show that laser singulation of IC packages is efficient and reliable.
Source Title:	Proceedings of SPIE - The International Society for Optical Engineering
URI:	http://scholarbank.nus.edu.sg/handle/10635/70767
ISSN:	0277786X
DOI:	10.1117/12.456850
Appears in Collections:	Staff Publications

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