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Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.456850
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dc.titleLaser singulation of IC packages
dc.contributor.authorAn, C.
dc.contributor.authorYe, K.
dc.contributor.authorYuan, Y.
dc.contributor.authorHong, M.
dc.contributor.authorLu, Y.
dc.date.accessioned2014-06-19T03:15:59Z
dc.date.available2014-06-19T03:15:59Z
dc.date.issued2002
dc.identifier.citationAn, C., Ye, K., Yuan, Y., Hong, M., Lu, Y. (2002). Laser singulation of IC packages. Proceedings of SPIE - The International Society for Optical Engineering 4426 : 371-373. ScholarBank@NUS Repository. https://doi.org/10.1117/12.456850
dc.identifier.issn0277786X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70767
dc.description.abstractThe separation of IC packages from a BGA board is realized by means of laser multi-scan method. The laser used in the study is a double frequency Nd-YAG laser with wavelength of 532 nm. The big problem in the laser processing approach mainly arises from the multi-layer materials of BGA board with copper, polyethylene and epoxy glass fiber, because of their different absorption coefficient to the laser beam and their different heat conductivity. In the experiment approach, the effects of laser parameters, such as wavelength, on the dicing efficiency has been investigated for choosing laser. The influence of sample side for laser incidence on cut profile and, the influence of the focused extent of laser beam on singulation speed are discussed. The experimental results show that laser singulation of IC packages is efficient and reliable.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1117/12.456850
dc.sourceScopus
dc.subjectIC package
dc.subjectLaser machining
dc.subjectMulti-layer material cutting
dc.subjectMulti-scan
dc.subjectSingulation
dc.typeConference Paper
dc.contributor.departmentDATA STORAGE INSTITUTE
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1117/12.456850
dc.description.sourcetitleProceedings of SPIE - The International Society for Optical Engineering
dc.description.volume4426
dc.description.page371-373
dc.description.codenPSISD
dc.identifier.isiut000176422100080
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