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Title: Laser applications in integrated circuit packaging
Authors: Lu, Y.F. 
Song, W.D. 
Ren, Z.M.
An, C.W.
Ye, K.D. 
Liu, D.M.
Wang, W.J. 
Hong, M.H. 
Chong, T.C. 
Keywords: Laser bumping
Laser deflash
Laser mold cleaning
Laser packaging
Laser reflow
Laser singulation
Laser tagging
Issue Date: 2002
Citation: Lu, Y.F., Song, W.D., Ren, Z.M., An, C.W., Ye, K.D., Liu, D.M., Wang, W.J., Hong, M.H., Chong, T.C. (2002). Laser applications in integrated circuit packaging. Proceedings of SPIE - The International Society for Optical Engineering 4637 : 581-591. ScholarBank@NUS Repository.
Abstract: Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser marking on packages and on Si wafers. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma and laser induced acoustic wave has been used to understand and to control the processes involved in these applications.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
ISSN: 0277786X
DOI: 10.1117/12.470667
Appears in Collections:Staff Publications

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