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https://doi.org/10.1016/j.matlet.2011.10.099
Title: | Copper nanoparticles embedded in a polyimide film for non-volatile memory applications | Authors: | Gupta, R.K. Kusuma, D.Y. Lee, P.S. Srinivasan, M.P. |
Keywords: | Copper nanoparticles Nonvolatile memory Polyimide Solution processable |
Issue Date: | 1-Feb-2012 | Citation: | Gupta, R.K., Kusuma, D.Y., Lee, P.S., Srinivasan, M.P. (2012-02-01). Copper nanoparticles embedded in a polyimide film for non-volatile memory applications. Materials Letters 68 : 287-289. ScholarBank@NUS Repository. https://doi.org/10.1016/j.matlet.2011.10.099 | Abstract: | The charge storage and retention characteristics of a nanoparticle-laden thin polyimide film were investigated for application in non-volatile memory devices. Well-dispersed and uniform sized metallic copper nanoparticles (CuNPs) were formed as embedded entities within the confines of polyimide film that was cast from solution. The nanoparticle-containing films were characterized by X-ray photoelectron spectroscopy, atomic force and scanning electron microscopies. Capacitance-voltage measurements showed that the embedded CuNPs functioned as a floating gate in metal-insulator-semiconductor-type capacitor and exhibited a large hysteresis window of 1.52 V. C-t measurements conducted after applying a charging bias of 5 V showed that the charge was retained beyond 20,000 s. The technique holds promise for developing low-cost processes for memory devices that employ relatively inexpensive materials, and yet demonstrate very good performance. © 2011 Elsevier B.V. All rights reserved. | Source Title: | Materials Letters | URI: | http://scholarbank.nus.edu.sg/handle/10635/63670 | ISSN: | 0167577X | DOI: | 10.1016/j.matlet.2011.10.099 |
Appears in Collections: | Staff Publications |
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