Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.matlet.2011.10.099
Title: Copper nanoparticles embedded in a polyimide film for non-volatile memory applications
Authors: Gupta, R.K.
Kusuma, D.Y.
Lee, P.S.
Srinivasan, M.P. 
Keywords: Copper nanoparticles
Nonvolatile memory
Polyimide
Solution processable
Issue Date: 1-Feb-2012
Source: Gupta, R.K., Kusuma, D.Y., Lee, P.S., Srinivasan, M.P. (2012-02-01). Copper nanoparticles embedded in a polyimide film for non-volatile memory applications. Materials Letters 68 : 287-289. ScholarBank@NUS Repository. https://doi.org/10.1016/j.matlet.2011.10.099
Abstract: The charge storage and retention characteristics of a nanoparticle-laden thin polyimide film were investigated for application in non-volatile memory devices. Well-dispersed and uniform sized metallic copper nanoparticles (CuNPs) were formed as embedded entities within the confines of polyimide film that was cast from solution. The nanoparticle-containing films were characterized by X-ray photoelectron spectroscopy, atomic force and scanning electron microscopies. Capacitance-voltage measurements showed that the embedded CuNPs functioned as a floating gate in metal-insulator-semiconductor-type capacitor and exhibited a large hysteresis window of 1.52 V. C-t measurements conducted after applying a charging bias of 5 V showed that the charge was retained beyond 20,000 s. The technique holds promise for developing low-cost processes for memory devices that employ relatively inexpensive materials, and yet demonstrate very good performance. © 2011 Elsevier B.V. All rights reserved.
Source Title: Materials Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/63670
ISSN: 0167577X
DOI: 10.1016/j.matlet.2011.10.099
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