Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.matlet.2011.10.099
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dc.titleCopper nanoparticles embedded in a polyimide film for non-volatile memory applications
dc.contributor.authorGupta, R.K.
dc.contributor.authorKusuma, D.Y.
dc.contributor.authorLee, P.S.
dc.contributor.authorSrinivasan, M.P.
dc.date.accessioned2014-06-17T07:38:10Z
dc.date.available2014-06-17T07:38:10Z
dc.date.issued2012-02-01
dc.identifier.citationGupta, R.K., Kusuma, D.Y., Lee, P.S., Srinivasan, M.P. (2012-02-01). Copper nanoparticles embedded in a polyimide film for non-volatile memory applications. Materials Letters 68 : 287-289. ScholarBank@NUS Repository. https://doi.org/10.1016/j.matlet.2011.10.099
dc.identifier.issn0167577X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/63670
dc.description.abstractThe charge storage and retention characteristics of a nanoparticle-laden thin polyimide film were investigated for application in non-volatile memory devices. Well-dispersed and uniform sized metallic copper nanoparticles (CuNPs) were formed as embedded entities within the confines of polyimide film that was cast from solution. The nanoparticle-containing films were characterized by X-ray photoelectron spectroscopy, atomic force and scanning electron microscopies. Capacitance-voltage measurements showed that the embedded CuNPs functioned as a floating gate in metal-insulator-semiconductor-type capacitor and exhibited a large hysteresis window of 1.52 V. C-t measurements conducted after applying a charging bias of 5 V showed that the charge was retained beyond 20,000 s. The technique holds promise for developing low-cost processes for memory devices that employ relatively inexpensive materials, and yet demonstrate very good performance. © 2011 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.matlet.2011.10.099
dc.sourceScopus
dc.subjectCopper nanoparticles
dc.subjectNonvolatile memory
dc.subjectPolyimide
dc.subjectSolution processable
dc.typeArticle
dc.contributor.departmentCHEMICAL & BIOMOLECULAR ENGINEERING
dc.description.doi10.1016/j.matlet.2011.10.099
dc.description.sourcetitleMaterials Letters
dc.description.volume68
dc.description.page287-289
dc.description.codenMLETD
dc.identifier.isiut000300480600082
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