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|Title:||Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites||Authors:||Nai, S.M.L.
|Issue Date:||Apr-2010||Citation:||Nai, S.M.L., Kuma, J.V.M., Alam, M.E., Zhong, X.L., Babaghorbani, P., Gupta, M. (2010-04). Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites. Journal of Materials Engineering and Performance 19 (3) : 335-341. ScholarBank@NUS Repository. https://doi.org/10.1007/s11665-009-9481-z||Abstract:||In the present study, Sn-0.7Cu and Sn-3.5Ag lead-free solders used in the electronics packaging industry were reinforced with different volume percentages of nano-size alumina and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites. These composites were developed using microwave-assisted powder metallurgy route followed by extrusion. The effects of addition of particulates on the physical, microstructural, and mechanical properties of the nanocomposites were investigated. Mechanical properties (microhardness, 0.2% YS, and UTS) for both composite systems increase with the presence of particulates. The best tensile strength was realized for composite solders reinforced with 1.5 vol.% alumina and 0.7 vol.% tin oxide particulates, which far exceeds the strength of eutectic Sn-Pb solder. The morphology of pores was observed to be one of the most dominating factors affecting the strength of materials. © ASM International.||Source Title:||Journal of Materials Engineering and Performance||URI:||http://scholarbank.nus.edu.sg/handle/10635/61655||ISSN:||10599495||DOI:||10.1007/s11665-009-9481-z|
|Appears in Collections:||Staff Publications|
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