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Title: Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites
Authors: Nai, S.M.L.
Kuma, J.V.M. 
Alam, M.E.
Zhong, X.L. 
Babaghorbani, P.
Gupta, M. 
Keywords: Lead-free solder
Metal-matrix nanocomposite
Microwave sintering
Tensile properties
Issue Date: Apr-2010
Citation: Nai, S.M.L., Kuma, J.V.M., Alam, M.E., Zhong, X.L., Babaghorbani, P., Gupta, M. (2010-04). Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites. Journal of Materials Engineering and Performance 19 (3) : 335-341. ScholarBank@NUS Repository.
Abstract: In the present study, Sn-0.7Cu and Sn-3.5Ag lead-free solders used in the electronics packaging industry were reinforced with different volume percentages of nano-size alumina and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites. These composites were developed using microwave-assisted powder metallurgy route followed by extrusion. The effects of addition of particulates on the physical, microstructural, and mechanical properties of the nanocomposites were investigated. Mechanical properties (microhardness, 0.2% YS, and UTS) for both composite systems increase with the presence of particulates. The best tensile strength was realized for composite solders reinforced with 1.5 vol.% alumina and 0.7 vol.% tin oxide particulates, which far exceeds the strength of eutectic Sn-Pb solder. The morphology of pores was observed to be one of the most dominating factors affecting the strength of materials. © ASM International.
Source Title: Journal of Materials Engineering and Performance
ISSN: 10599495
DOI: 10.1007/s11665-009-9481-z
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