Please use this identifier to cite or link to this item: https://doi.org/10.1007/s11665-009-9481-z
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dc.titleUsing microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites
dc.contributor.authorNai, S.M.L.
dc.contributor.authorKuma, J.V.M.
dc.contributor.authorAlam, M.E.
dc.contributor.authorZhong, X.L.
dc.contributor.authorBabaghorbani, P.
dc.contributor.authorGupta, M.
dc.date.accessioned2014-06-17T06:37:45Z
dc.date.available2014-06-17T06:37:45Z
dc.date.issued2010-04
dc.identifier.citationNai, S.M.L., Kuma, J.V.M., Alam, M.E., Zhong, X.L., Babaghorbani, P., Gupta, M. (2010-04). Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites. Journal of Materials Engineering and Performance 19 (3) : 335-341. ScholarBank@NUS Repository. https://doi.org/10.1007/s11665-009-9481-z
dc.identifier.issn10599495
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/61655
dc.description.abstractIn the present study, Sn-0.7Cu and Sn-3.5Ag lead-free solders used in the electronics packaging industry were reinforced with different volume percentages of nano-size alumina and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites. These composites were developed using microwave-assisted powder metallurgy route followed by extrusion. The effects of addition of particulates on the physical, microstructural, and mechanical properties of the nanocomposites were investigated. Mechanical properties (microhardness, 0.2% YS, and UTS) for both composite systems increase with the presence of particulates. The best tensile strength was realized for composite solders reinforced with 1.5 vol.% alumina and 0.7 vol.% tin oxide particulates, which far exceeds the strength of eutectic Sn-Pb solder. The morphology of pores was observed to be one of the most dominating factors affecting the strength of materials. © ASM International.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1007/s11665-009-9481-z
dc.sourceScopus
dc.subjectLead-free solder
dc.subjectMetal-matrix nanocomposite
dc.subjectMicrowave sintering
dc.subjectTensile properties
dc.typeArticle
dc.contributor.departmentCIVIL ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1007/s11665-009-9481-z
dc.description.sourcetitleJournal of Materials Engineering and Performance
dc.description.volume19
dc.description.issue3
dc.description.page335-341
dc.description.codenJMEPE
dc.identifier.isiut000275541100004
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