Please use this identifier to cite or link to this item:
|Title:||Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites|
|Citation:||Nai, S.M.L., Kuma, J.V.M., Alam, M.E., Zhong, X.L., Babaghorbani, P., Gupta, M. (2010-04). Using microwave-assisted powder metallurgy route and nano-size reinforcements to develop high-strength solder composites. Journal of Materials Engineering and Performance 19 (3) : 335-341. ScholarBank@NUS Repository. https://doi.org/10.1007/s11665-009-9481-z|
|Abstract:||In the present study, Sn-0.7Cu and Sn-3.5Ag lead-free solders used in the electronics packaging industry were reinforced with different volume percentages of nano-size alumina and tin oxide particulates, respectively, to synthesize two new sets of nanocomposites. These composites were developed using microwave-assisted powder metallurgy route followed by extrusion. The effects of addition of particulates on the physical, microstructural, and mechanical properties of the nanocomposites were investigated. Mechanical properties (microhardness, 0.2% YS, and UTS) for both composite systems increase with the presence of particulates. The best tensile strength was realized for composite solders reinforced with 1.5 vol.% alumina and 0.7 vol.% tin oxide particulates, which far exceeds the strength of eutectic Sn-Pb solder. The morphology of pores was observed to be one of the most dominating factors affecting the strength of materials. © ASM International.|
|Source Title:||Journal of Materials Engineering and Performance|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jul 21, 2018
WEB OF SCIENCETM
checked on Jun 18, 2018
checked on Jun 29, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.