Please use this identifier to cite or link to this item:
|Title:||Coplanarity study on ball grid array packaging||Authors:||Tay, C.J.
|Keywords:||Ball grid array
|Issue Date:||Aug-2001||Citation:||Tay, C.J., He, X., Kang, X., Quan, C., Shang, H.M. (2001-08). Coplanarity study on ball grid array packaging. Optical Engineering 40 (8) : 1608-1612. ScholarBank@NUS Repository. https://doi.org/10.1117/1.1386639||Abstract:||We describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two-channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing. © 2001 Society of Photo-Optical Instrumentation Engineers.||Source Title:||Optical Engineering||URI:||http://scholarbank.nus.edu.sg/handle/10635/59803||ISSN:||00913286||DOI:||10.1117/1.1386639|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jan 24, 2020
WEB OF SCIENCETM
checked on Jan 17, 2020
checked on Jan 28, 2020
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.