Please use this identifier to cite or link to this item: https://doi.org/10.1117/1.1386639
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dc.titleCoplanarity study on ball grid array packaging
dc.contributor.authorTay, C.J.
dc.contributor.authorHe, X.
dc.contributor.authorKang, X.
dc.contributor.authorQuan, C.
dc.contributor.authorShang, H.M.
dc.date.accessioned2014-06-17T06:15:47Z
dc.date.available2014-06-17T06:15:47Z
dc.date.issued2001-08
dc.identifier.citationTay, C.J., He, X., Kang, X., Quan, C., Shang, H.M. (2001-08). Coplanarity study on ball grid array packaging. Optical Engineering 40 (8) : 1608-1612. ScholarBank@NUS Repository. https://doi.org/10.1117/1.1386639
dc.identifier.issn00913286
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/59803
dc.description.abstractWe describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two-channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing. © 2001 Society of Photo-Optical Instrumentation Engineers.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1117/1.1386639
dc.sourceScopus
dc.subjectBall grid array
dc.subjectDigital correlation
dc.subjectStereoscopic method
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1117/1.1386639
dc.description.sourcetitleOptical Engineering
dc.description.volume40
dc.description.issue8
dc.description.page1608-1612
dc.description.codenOPEGA
dc.identifier.isiut000170933100028
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