Coplanarity study on ball grid array packaging
Tay, C.J. He, X. Kang, X. Quan, C. Shang, H.M.
He, X.
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Abstract
We describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two-channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing. © 2001 Society of Photo-Optical Instrumentation Engineers.
Keywords
Ball grid array, Digital correlation, Stereoscopic method
Source Title
Optical Engineering
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Series/Report No.
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Date
2001-08
DOI
10.1117/1.1386639
Type
Article