Please use this identifier to cite or link to this item: https://doi.org/10.1117/1.1386639
Title: Coplanarity study on ball grid array packaging
Authors: Tay, C.J. 
He, X.
Kang, X. 
Quan, C. 
Shang, H.M. 
Keywords: Ball grid array
Digital correlation
Stereoscopic method
Issue Date: Aug-2001
Source: Tay, C.J., He, X., Kang, X., Quan, C., Shang, H.M. (2001-08). Coplanarity study on ball grid array packaging. Optical Engineering 40 (8) : 1608-1612. ScholarBank@NUS Repository. https://doi.org/10.1117/1.1386639
Abstract: We describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two-channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing. © 2001 Society of Photo-Optical Instrumentation Engineers.
Source Title: Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/59803
ISSN: 00913286
DOI: 10.1117/1.1386639
Appears in Collections:Staff Publications

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