Please use this identifier to cite or link to this item:
|Title:||Coplanarity study on ball grid array packaging|
|Authors:||Tay, C.J. |
|Keywords:||Ball grid array|
|Source:||Tay, C.J., He, X., Kang, X., Quan, C., Shang, H.M. (2001-08). Coplanarity study on ball grid array packaging. Optical Engineering 40 (8) : 1608-1612. ScholarBank@NUS Repository. https://doi.org/10.1117/1.1386639|
|Abstract:||We describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two-channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing. © 2001 Society of Photo-Optical Instrumentation Engineers.|
|Source Title:||Optical Engineering|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Feb 14, 2018
WEB OF SCIENCETM
checked on Jan 22, 2018
checked on Feb 19, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.