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|Title:||Coplanarity study on ball grid array packaging|
|Authors:||Tay, C.J. |
|Keywords:||Ball grid array|
|Citation:||Tay, C.J., He, X., Kang, X., Quan, C., Shang, H.M. (2001-08). Coplanarity study on ball grid array packaging. Optical Engineering 40 (8) : 1608-1612. ScholarBank@NUS Repository. https://doi.org/10.1117/1.1386639|
|Abstract:||We describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two-channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing. © 2001 Society of Photo-Optical Instrumentation Engineers.|
|Source Title:||Optical Engineering|
|Appears in Collections:||Staff Publications|
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