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https://doi.org/10.1109/LMWC.2005.856829
| Title: | Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges | Authors: | Yin, W.-Y. Dong, X.T. Mao, J. Li, L.-W. |
Keywords: | Attenuation constant Average power handling capability (APHC) Benzocyclobutene (BCB) Distributed pa-rameters Finite-ground thin-film microstrip lines (FG-TFMLs) Thermal conductivity |
Issue Date: | Oct-2005 | Citation: | Yin, W.-Y., Dong, X.T., Mao, J., Li, L.-W. (2005-10). Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges. IEEE Microwave and Wireless Components Letters 15 (10) : 715-717. ScholarBank@NUS Repository. https://doi.org/10.1109/LMWC.2005.856829 | Abstract: | Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground thin-film microstrip lines (TFMLs) on Benzocyclobutene (BCB) and polyimide films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc. It is believed that the proposed approach is useful in the design of practical TFML circuits. © 2005 IEEE. | Source Title: | IEEE Microwave and Wireless Components Letters | URI: | http://scholarbank.nus.edu.sg/handle/10635/55177 | ISSN: | 15311309 | DOI: | 10.1109/LMWC.2005.856829 |
| Appears in Collections: | Staff Publications |
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