Please use this identifier to cite or link to this item: https://doi.org/10.1109/LMWC.2005.856829
Title: Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges
Authors: Yin, W.-Y.
Dong, X.T. 
Mao, J.
Li, L.-W. 
Keywords: Attenuation constant
Average power handling capability (APHC)
Benzocyclobutene (BCB)
Distributed pa-rameters
Finite-ground thin-film microstrip lines (FG-TFMLs)
Thermal conductivity
Issue Date: Oct-2005
Citation: Yin, W.-Y., Dong, X.T., Mao, J., Li, L.-W. (2005-10). Average power handling capability of finite-ground thin-film microstrip lines over ultra-wide frequency ranges. IEEE Microwave and Wireless Components Letters 15 (10) : 715-717. ScholarBank@NUS Repository. https://doi.org/10.1109/LMWC.2005.856829
Abstract: Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground thin-film microstrip lines (TFMLs) on Benzocyclobutene (BCB) and polyimide films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc. It is believed that the proposed approach is useful in the design of practical TFML circuits. © 2005 IEEE.
Source Title: IEEE Microwave and Wireless Components Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/55177
ISSN: 15311309
DOI: 10.1109/LMWC.2005.856829
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

8
checked on Nov 22, 2018

WEB OF SCIENCETM
Citations

6
checked on Nov 6, 2018

Page view(s)

51
checked on Sep 29, 2018

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.