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| Title: | Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™ | Authors: | Baochang Xu Yu Zhang Chun Fei Siah Voon Yew Thean Yeow Kheng Lim |
Keywords: | Silicon photonics Advanced packaging |
Issue Date: | 18-Sep-2022 | Publisher: | Optica Publishing Group | Citation: | Baochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim (2022-09-18). Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™. 2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022 : 1-4. ScholarBank@NUS Repository. | Rights: | Attribution-NonCommercial-NoDerivatives 4.0 International | Abstract: | The incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13um. High-precision bonder with laser-assisted bonding capability enables heterogeneous integration of optical components with higher packing density due to a small heat-affected zone radius of 280um. | Source Title: | 2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022 | URI: | https://scholarbank.nus.edu.sg/handle/10635/238261 | ISBN: | 978-1-957171-15-9 | Rights: | Attribution-NonCommercial-NoDerivatives 4.0 International |
| Appears in Collections: | Elements Staff Publications |
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| ECOC2022_manuscript.pdf | 664.82 kB | Adobe PDF | OPEN | Post-print | View/Download |
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