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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/238261
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dc.titlePassively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™
dc.contributor.authorBaochang Xu
dc.contributor.authorYu Zhang
dc.contributor.authorChun Fei Siah
dc.contributor.authorVoon Yew Thean
dc.contributor.authorYeow Kheng Lim
dc.date.accessioned2023-03-20T03:57:10Z
dc.date.available2023-03-20T03:57:10Z
dc.date.issued2022-09-18
dc.identifier.citationBaochang Xu, Yu Zhang, Chun Fei Siah, Voon Yew Thean, Yeow Kheng Lim (2022-09-18). Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer™. 2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022 : 1-4. ScholarBank@NUS Repository.
dc.identifier.isbn978-1-957171-15-9
dc.identifier.urihttps://scholarbank.nus.edu.sg/handle/10635/238261
dc.description.abstractThe incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13um. High-precision bonder with laser-assisted bonding capability enables heterogeneous integration of optical components with higher packing density due to a small heat-affected zone radius of 280um.
dc.language.isoen
dc.publisherOptica Publishing Group
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/
dc.subjectSilicon photonics
dc.subjectAdvanced packaging
dc.typeConference Paper
dc.contributor.departmentELECTRICAL AND COMPUTER ENGINEERING
dc.description.sourcetitle2022 European Conference on Optical Communication (ECOC), Basel, Switzerland, 2022
dc.description.page1-4
dc.published.statePublished
dc.grant.fundingagencyNational Research Foundation, Singapore (NRF) under NRF’s Medium Sized Centre: Singapore Hybrid- Integrated Next-Generation μ-Electronics (SHINE) Centre
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