Please use this identifier to cite or link to this item: https://doi.org/10.3390/jmmp4030081
Title: Suppression of Polycrystalline Diamond ToolWear with Mechanochemical Effects in Micromachining of Ferrous Metal
Authors: Lee, YJ
Shen, YK
Wang, H 
Issue Date: 1-Sep-2020
Publisher: MDPI AG
Citation: Lee, YJ, Shen, YK, Wang, H (2020-09-01). Suppression of Polycrystalline Diamond ToolWear with Mechanochemical Effects in Micromachining of Ferrous Metal. Journal of Manufacturing and Materials Processing 4 (3) : 81-81. ScholarBank@NUS Repository. https://doi.org/10.3390/jmmp4030081
Abstract: A mechanochemical effect is investigated to reduce diamond tool wear by means of applying a surfactant to low-carbon magnetic iron during diamond turning. Orthogonal microcutting demonstrates the manifestation of the mechanochemical effect through the reduction of cutting forces by 30%, which supports the notion of lower cutting temperatures for reduced tribo-chemical wear. This is affrmed by the reduction in tool flank wear by up to 56% with the mechanochemical effect during diamond turning. While wear suppression increases by 9.4-16.15% with feeds from 5-20-m/rev, it is not proportional to the reduction in cutting forces (31-39.8%), which suggests that the reduction in cutting energy does not directly correspond with the reduction in heat energy to sustain tribo-chemical tool wear. The strain localization during chip formation is proposed to serve as a heat source that hinders the wear mitigation effciency. Finite element simulations demonstrate the heat generation during strain localization under the mechanochemical effect, which counteracts the reduced heat conversion from the plastic deformation and the transfer from tool-chip contact. Hence, this paper demonstrates the effectiveness of the mechanochemical method and its ability to reduce tool wear, but also establishes its limitations due to its inherent nature for heat generation.
Source Title: Journal of Manufacturing and Materials Processing
URI: https://scholarbank.nus.edu.sg/handle/10635/191851
ISSN: 25044494
DOI: 10.3390/jmmp4030081
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