Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/168573
Title: Material structure, properties, and dynamics through scanning transmission electron microscopy
Authors: Pennycook, S.J. 
Li, C. 
Li, M.
Tang, C. 
Okunishi, E.
Varela, M.
Kim, Y.-M.
Jang, J.H.e
Keywords: Electron energy loss spectroscopy
Energy loss near-edge fine structure
Energy-dispersive X-ray spectroscopy
Ferroelectric domain structures
Lead-free piezoelectrics
Nanofabrication
Point defect dynamics
Scanning transmission electron microscopy
Issue Date: 11-Apr-2018
Publisher: Springer
Citation: Pennycook, S.J., Li, C., Li, M., Tang, C., Okunishi, E., Varela, M., Kim, Y.-M., Jang, J.H.e (2018-04-11). Material structure, properties, and dynamics through scanning transmission electron microscopy. JOURNAL OF ANALYTICAL SCIENCE AND TECHNOLOGY 9 (1). ScholarBank@NUS Repository.
Abstract: Scanning transmission electron microscopy (STEM) has advanced rapidly in the last decade thanks to the ability to correct the major aberrations of the probe-forming lens. Now, atomic-sized beams are routine, even at accelerating voltages as low as 40 kV, allowing knock-on damage to be minimized in beam sensitive materials. The aberration-corrected probes can contain sufficient current for high-quality, simultaneous, imaging and analysis in multiple modes. Atomic positions can be mapped with picometer precision, revealing ferroelectric domain structures, composition can be mapped by energy-dispersive X-ray spectroscopy (EDX) and electron energy loss spectroscopy (EELS), and charge transfer can be tracked unit cell by unit cell using the EELS fine structure. Furthermore, dynamics of point defects can be investigated through rapid acquisition of multiple image scans. Today STEM has become an indispensable tool for analytical science at the atomic level, providing a whole new level of insights into the complex interplays that control material properties. © 2018, The Author(s).
Source Title: JOURNAL OF ANALYTICAL SCIENCE AND TECHNOLOGY
URI: https://scholarbank.nus.edu.sg/handle/10635/168573
ISSN: 20933134
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