Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.elspec.2005.01.256
Title: New soft X-ray facility SINS for surface and nanoscale science at SSLS
Authors: Yu, X. 
Wilhelmi, O. 
Moser, H.O. 
Vidyaraj, S.V. 
Gao, X. 
Wee, A.T.S. 
Nyunt, T.
Qian, H.
Zheng, H.
Keywords: Beamline
Monochromator
Photoemission
SINS
XMCD
Issue Date: Jun-2005
Citation: Yu, X., Wilhelmi, O., Moser, H.O., Vidyaraj, S.V., Gao, X., Wee, A.T.S., Nyunt, T., Qian, H., Zheng, H. (2005-06). New soft X-ray facility SINS for surface and nanoscale science at SSLS. Journal of Electron Spectroscopy and Related Phenomena 144-147 : 1031-1034. ScholarBank@NUS Repository. https://doi.org/10.1016/j.elspec.2005.01.256
Abstract: The first soft X-ray facility at the Singapore Synchrotron Light Source was built by FMB and commissioned in 2003. Dubbed SINS for surface, interface, and nanostructure science, it covers a photon energy range from 50 to 1200 eV. The photon beam can be set to left circular, right circular or linear polarization by changing the pitch and vertical position of the vertical focusing mirror of the prefocusing optics. The typical resolution (E/ΔE) and flux are about 1000 at 1010 photons/s or exceeding 4000 at 108 photons/s in a spot of about 1.5 mm × 0.2 mm on the sample. The performance of the beamline was measured using gas photoionization spectra of Ar, He, Kr, and N2 as well as an XMCD spectrum of a Ni sample. From the Ni XMCD signal, calculation shows that the degree of circular polarization can reach 95% at 850 eV photon energy. The end-station is presently equipped with a hemispherical electron energy analyzer and typical surface science diagnostics including LEED and ion sputtering. Upgrading with an in situ STM/AFM and a growth chamber is underway which will make SINS a unique tool for in situ surface and nanoscale science studies. © 2005 Elsevier B.V. All rights reserved.
Source Title: Journal of Electron Spectroscopy and Related Phenomena
URI: http://scholarbank.nus.edu.sg/handle/10635/113058
ISSN: 03682048
DOI: 10.1016/j.elspec.2005.01.256
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