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Quan, Chenggen

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Full Name
Quan, Chenggen
Variants
Chenggen, Q.
Quan, C.G.
Quan, C.
QUAN, CHENGGEN
 
Main Affiliation
 
Faculty
 

Publications

Results 201-215 of 215 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
201Nov-2001The use of circular optical grating for measuring angular rotation of mirrorsShang, H.M. ; Toh, S.L. ; Fu, Y. ; Quan, C. ; Tay, C.J. 
202May-2008Three-dimensional rigid body displacement measurement based on digital image correlationSun, W.; He, X.; Quan, C. ; Zheng, X.
20315-May-2011Two wavelength simultaneous DSPI and DSP for 3D displacement field measurementsBhaduri, B. ; Tay, C.J. ; Quan, C. ; Niu, H.; Sjödahl, M.
2042010Two-step dc-term-suppressed phase shifting technique in DSPIBhaduri, B. ; Tay, C.J. ; Quan, C. 
205Dec-2001Using laser scattering for detection of cracks on a microsolderball surfaceWang, S.H. ; Quan, C. ; Tay, C.J. ; Shang, H.M. 
2061-Jun-2007Vibration measurement by use of wavelet transform and temporal carrier techniqueQuan, C. ; Fu, Y. ; Tay, C.J. 
2072009Vibration measurement of a micro-structure by digital holographic microscopyShi, H. ; Fu, Y. ; Quan, C. ; Tay, C.J. ; He, X.
2082003Vibration measurement of micro-components by fringe projection methodWu, T.; Tay, C. ; Quan, C. ; Wang, S. ; Shang, H.
2092013Wafer level silicon mould fabrication and imprinting of high density microstructuresWong, T.I.; Ong, H.Y.; Lu, H.J.; Tse, M.S.; Quan, C.G. ; Ng, S.H.; Zhou, X.
210Apr-2009Wafer-level BCB bonding using a thermal press for microfluidicsZhou, X.; Virasawmy, S. ; Quan, C. 
2112009Warpage measurement using projection speckle correlation method and microscopic interferometrySun, W.; He, X.Y.; Quan, C. 
2121-Apr-2006Wavelet analysis of digital shearing speckle patterns with a temporal carrierQuan, C. ; Fu, Y. ; Miao, H. 
1320-Feb-2005Wavelet analysis of speckle patterns with a temporal carrierFu, Y. ; Tay, C.J. ; Quan, C. ; Miao, H. 
14Sep-2001Whole field surface roughness measurement by laser speckle correlation techniqueToh, S.L. ; Quan, C. ; Woo, K.C.; Tay, C.J. ; Shang, H.M. 
152009Whole-field board strain and displacement characterization during drop impact using a single camera DIC techniqueDe Lim, F.Z.; Tan, L.B.; Quan, C. ; Tee, T.Y.