Please use this identifier to cite or link to this item:
|Title:||Using laser scattering for detection of cracks on a microsolderball surface||Authors:||Wang, S.H.
|Issue Date:||Dec-2001||Citation:||Wang, S.H., Quan, C., Tay, C.J., Shang, H.M. (2001-12). Using laser scattering for detection of cracks on a microsolderball surface. Journal of Nondestructive Evaluation 20 (4) : 145-151. ScholarBank@NUS Repository. https://doi.org/10.1023/A:1014765208723||Abstract:||In this paper, a scanning laser probe has been developed to detect and measure cracks on a microsolderball surface. The technique, based on a light-scattering method that employs a low-power He-Ne laser and conventional optical components, enables the laser beam to be focused on the test surface. In the relative scanning between the test surface and laser probe, the specularly reflected light intensity acquired by a photodiode would exhibit the change of the scattered-light intensity, which can be used to determine the size of cracks on the solderball. Proof-of-concept experiments have been performed with measurement of cracks of different sizes (from 4 μm to 60 μm) on the microsolderball.||Source Title:||Journal of Nondestructive Evaluation||URI:||http://scholarbank.nus.edu.sg/handle/10635/61654||ISSN:||01959298||DOI:||10.1023/A:1014765208723|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Nov 21, 2019
checked on Oct 27, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.