Full Name
Yong Wei Zhang
Variants
Zhang, Y.-w.
Yongwei, Z.
Zhang, Y.W.
Zhang, Y.
Zhang, Y.-W.
Zhang Yong Wei
 
 
 
Email
msezyw@nus.edu.sg
 

Publications

Results 61-80 of 149 (Search time: 0.006 seconds).

Issue DateTitleAuthor(s)
6121-Nov-2008Formation of surface structures of a heteroepitaxial film via controlled nucleation and cooperative propagationLiu, P.; Zhang, Y.W. 
622004Glass forming ability and type of eutectic coupled zoneTan, H. ; Zhang, Y. ; Ma, D.; Li, Y. 
63Aug-2009Grain boundary finite length facetingWu, Z.X.; Zhang, Y.W. ; Srolovitz, D.J.
642007Heteroepitaxial growth of quantum wire arrays through prepatterning substrate surfacesLiu, P.; Lu, C.; Zhang, Y.-W. ; Lam, K.-Y.
652007Heteroepitaxial growth of quantum wire arrays through prepatterning substrate surfacesLiu, P.; Lu, C.; Zhang, Y.-W. ; Lam, K.-Y.
662015High aspect ratio 10-nm-scale nanoaperture arrays with template-guided metal dewettingWang, Y.M; Lu, L; Srinivasan, B.M; Asbahi, M; Zhang, Y.W ; Yang, J.K.W
671-Aug-2010Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysisWong, W.H.; Guo, T.F.; Zhang, Y.W. ; Cheng, L. 
681-Aug-2010Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysisWong, W.H.; Guo, T.F.; Zhang, Y.W. ; Cheng, L. 
69Feb-2006Hydrothermal effects on the thermomechanical properties of high performance epoxy/clay nanocompositesWang, L.; Wang, K.; Chen, L.; He, C.; Wang, L. ; Zhang, Y. 
702005Indentation creep of polymeric materials: Experimental and analysisZeng, K. ; Zhang, Y.-W. 
712016Insensitivity to Flaws Leads to Damage Tolerance in Brittle Architected Meta-MaterialsMontemayor, L.C; Wong, W.H; Zhang, Y.-W ; Greer, J.R
722009Instability pathways of hydrogel microlenses under concentrated loadingsZhang, X.X.; Zeng, K.Y. ; Li, J. ; Zhang, Y.W. 
73Dec-2001Interface delamination generated by indentation in thin film systems - A computational mechanics studyZhang, Y.W. ; Zeng, K.Y. ; Thampurun, R.
74Feb-2003Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics modelLiu, P.; Cheng, L. ; Zhang, Y.-W. 
7520-Jan-2010International Journal of Modern Physics B: PrefaceZeng, K. ; Zhang, Y.-W. ; Chen, Z.; Dao, M.; Ramamurty, U.
7620-Jan-2010International Journal of Modern Physics B: PrefaceZeng, K. ; Zhang, Y.-W. ; Chen, Z.; Dao, M.; Ramamurty, U.
772012Kinetic nanofriction: A mechanism transition from quasi-continuous to ballistic-like brownian regimeZadeh, M.J; Reddy, C.D; Sorkin, V; Zhang, Y.-W 
788-Dec-2023Laser-Ironing Induced Capping Layer on Co-ZIF-L Promoting In Situ Surface Modification to High-Spin Oxide–Carbon Hybrids on the “Real Catalyst” for High OER Activity and StabilityWeihao Liu; Jing Yang; Yizhe Zhao; Ximeng Liu ; Jian Heng; Minghui Hong; Yong-Wei Zhang ; John Wang 
79May-2006Level set simulation of dislocation dynamics in thin filmsQuek, S.S.; Xiang, Y.; Zhang, Y.W. ; Srolovitz, D.J.; Lu, C.
802008Low-temperature epitaxy of KTaO3 and KNbO3 filmsGoh, G.K.L.; Chan, K.Y.S.; Tan, B.S.K.; Zhang, Y.W. ; Kim, J.H.; Osipowicz, T.