Ang,Simon Saw-Teong

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Full Name

Ang,Simon Saw-Teong

(not current staff)

Variants

Ang, S.S.
Ang, S.
ANG, SIMON SAW-TEONG
ANG, SIMON S.
ANG, SIMON S

Main Affiliation

MECHANICAL ENGINEERING

Faculty

COLLEGE OF DESIGN AND ENGINEERING

bieangs@nus.edu.sg

Refined By:

Author: Tay, A.A.O.

Author: Kripesh, V.

Results 1-3 of 3 (Search time: 0.003 seconds).

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	Issue Date	Title	Author(s)
1	May-2004	Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package	Tay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T.
2	May-2004	Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package	Tay, A.A.O. ; Iyer, M.K.; Tummala, R.R.; Kripesh, V.; Wong, E.H.; Swaminathan, M.; Wong, C.P.; Rotaru, M.D.; Doraiswami, R.; Ang, S.S. ; Kang, E.T.
3	May-2006	Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging	Liao, E.B.; Tay, A.A.O. ; Ang, S.S. ; Feng, H.H.; Nagarajan, R.; Kripesh, V.