VAIDYANATHAN KRIPESH

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Full Name

(not current staff)

Variants

Vaidyanathan, K.
Kripesh, V.

Main Affiliation

MECHANICAL ENGINEERING

Faculty

COLLEGE OF DESIGN AND ENGINEERING

mpevk@nus.edu.sg

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	Issue Date	Title	Author(s)
1	Aug-2005	A study on microstructural and mechanical properties of nanocrystalline nickel	Mohankumar, K.; Shyong, S.K. ; Jayaganthan, R. ; Tay, A.A.O. ; Kripesh, V.
2	2005	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging	Gupta, M. ; Pan, M.Y.; Tay, A.A.O. ; Vaidyanathan, K.
3	May-2006	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging	Pan, M.Y.; Gupta, M. ; Tay, A.A.O. ; Vaidyanathan, K.
4	Mar-2010	Integrated liquid cooling systems for 3-D stacked TSV modules	Tang, G.Y.; Tan, S.P.; Khan, N.; Pinjala, D.; Lau, J.H.; Yu, A.B.; Vaidyanathan, K. ; Toh, K.C.
5	2011	Solutions strategies for die shift problem in wafer level compression molding	Sharma, G.; Kumar, A.; Rao, V.S.; Ho, S.W.; Kripesh, V.