Full Name
Rengaswamy Jayaganthan
(not current staff)
Jayaganthan, R.
Main Affiliation
Researcher ID


Results 1-13 of 13 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
1Aug-2005A study on microstructural and mechanical properties of nanocrystalline nickelMohankumar, K.; Shyong, S.K. ; Jayaganthan, R. ; Tay, A.A.O. ; Kripesh, V. 
22004A study on the mechanical behavior of the sputtered nickel thin Films for UBM applicationsSekhar, V.N.; Srinivasarao, V.; Jayaganthan, R. ; Mohankumar, K.; Tay, A.A.O. 
3Aug-2005Energetics of copper nanowiresJayabalan, J. ; Jayaganthan, R. ; Tay, A.A.O. ; Leong, O.B.
42005Experimental investigation and Monte Carlo Simulation of glass transition in polymer nanocompositesJayaganthan, R. ; Vora, R.H. 
5Apr-2006Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couplesJayaganthan, R. ; Mohankumar, K.; Sekhar, V.N.; Tay, A.A.O. ; Kripesh, V.
62004Fractal analysis of Sn-Ag, Sn-Ag-Cu, Sn-Ag-Bi interfacial morphology in flipchip packaging applicationsJayaganthan, R. ; Mohankumar, K.; Tay, A.A.O. ; Kripesh, V.
7Jul-2004Influence of homo- and heterocharges on the growth dynamics of electrical treesSarathi, R.; AnilKumar, C.R.; Venkataseshaiah, C.; Jayaganthan, R. 
82005Monte Carlo simulation of surface segregation in nanoparticlesJayaganthan, R. ; Chow, G.M. 
9Apr-2005Nanoindentation study of nanocrystalline nickelJayaganthan, R. ; Mohankumar, K.; Tay, A.A.O. 
102004Nanoindentation study of the sputtered Cu thin films for interconnect applicationsSrinivasarao, V.; Jayaganthan, R. ; Sekhar, V.N.; Mohankumar, K.; Tay, A.A.O. ; Kripesh, V.
112005Synthesis, fabrication, characterization, properties and thermo-oxldatlve stability study of poly(ether imlde)/MMT clay nanocompositesVora, R.H. ; Jayaganthan, R. ; Wang, Z.; Thin, E.T.; Bang, T.K.
122005Thermodynamic modeling of surface segregation in Au-Ti nanoparticlesJayaganthan, R. ; Chow, G.M. 
131-Aug-2002Thermodynamics of surface compositional segregation in Ni-Co nanoparticlesJayaganthan, R. ; Chow, G.M.