Organization name
MECHANICAL ENGINEERING


Results 9901-9920 of 10893 (Search time: 0.016 seconds).

Issue DateTitleAuthor(s)
9901Aug-2002A three-dimensional nonlinear active cochlear model analyzed by the WKB-numeric methodLim, K.-M. ; Steele, C.R.
9902Feb-1998A three-dimensional modeling of wire sweep incorporating resin cureWu, J.H.; Tay, A.A.O. ; Yeo, K.S. ; Lim, T.B.
9903Jul-1995A three-dimensional model of chip flow, chip curl and chip breaking under the concept of equivalent parametersRahman, M.; Seah, K.H.W. ; Li, X.P.; Zhang, X.D.
9904Dec-1996A three-dimensional model of chip flow, chip curl and chip breaking for oblique cuttingSeah, K.H.W. ; Rahman, M. ; Li, X.P. ; Zhang, X.D.
990528-Oct-2011A three-dimensional hybrid meshfree-Cartesian scheme for fluid-body interactionYu, P. ; Yeo, K.S. ; Shyam Sundar, D. ; Ang, S.J.
9906Sep-2009A three-dimensional finite element analysis of interface delamination in a ductile film/hard substrate system induced by wedge indentationShe, C.; Zhang, Y.-W. ; Zeng, K.-Y. 
99072015A three-dimensional explicit sphere function-based gas-kinetic flux solver for simulation of inviscid compressible flowsYang L.M.; Shu Chang ; Wu J.
9908May-2022A three-dimensional dynamic mode decomposition analysis of wind farm flow aerodynamicsDai, Xuan; Xu, Da; Zhang, Mengqi; Stevens, Richard JAM
9909Mar-2006A three-dimensional analytical cutting force model for micro end milling operationZaman, M.T.; Kumar, A.S. ; Rahman, M. ; Sreeram, S.
9910Jan-2003A three dimensional model for heat and mass transfer in convective wood dryingDedic, A.D.; Mujumdar, A.S. ; Voronjec, D.K.
99112013A three dimensional immersed smoothed finite element method (3D IS-FEM) for fluid-structure interaction problemsZhang, Z.-Q. ; Liu, G.R.; Khoo, B.C. 
9912Jun-2013A thin-walled polydimethylsiloxane bioreactor for high-density hepatocyte sandwich cultureTan, G.-D.S.; Toh, G.W.; Birgersson, E. ; Robens, J. ; van Noort, D.; Leo, H.L. 
991325-Feb-2011A thin plate formulation without rotation DOFs based on the radial point interpolation method and triangular cellsCui, X.Y.; Liu, G.R. ; Li, G.Y.; Zhang, G.Y.
99141-Sep-2006A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresistRao, V.S.; Kripesh, V.; Yoon, S.W.; Tay, A.A.O. 
9915Jan-2010A thermoeconomic analysis of biomass energy for trigenerationLian, Z.T.; Chua, K.J. ; Chou, S.K. 
99166-Jan-2012A THERMODYNAMICALLY-CONSISTENT THEORY FOR ABNORMAL GRAIN GROWTH IN POLYCRYSTALLINE METALS AND THE COUPLING OF FINITE-ELEMENT AND PHASE-FIELD METHODSMOSTAFA JAMSHIDIAN
99177-Mar-2008A thermodynamic study of peptides binding to carbon nanotubes based on a hydrophobic-polar lattice model using Monte Carlo simulationsCheng, Y.; Liu, G.R. ; Li, Z.R.; Lu, C.; Mi, D.
99181990A thermodynamic model for the analysis of screw expander performanceNg, K.C. ; Bong, T.Y. ; Lim, T.B.
991912-Aug-2009A Thermally Driven Two-Phase Cooling Device for CPU CoolingCHAN MARK AARON CHAN
9920Feb-2007A thermal lattice Boltzmann model with diffuse scattering boundary condition for micro thermal flowsNiu, X.D.; Shu, C. ; Chew, Y.T.