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Title: A Thermally Driven Two-Phase Cooling Device for CPU Cooling
Keywords: pool boiling, electronic cooling, two-phase thermosyphon, boiling visualization, boiling enhancement, subatmospheric pressure
Issue Date: 12-Aug-2009
Citation: CHAN MARK AARON CHAN (2009-08-12). A Thermally Driven Two-Phase Cooling Device for CPU Cooling. ScholarBank@NUS Repository.
Abstract: Since the dawn of the computer age, there has been tremendous advancement in terms of technology and global demand for electronic computing devices. The need for increased processing speed/functionality on a single chip and the miniaturization of each unit has led to an unprecedented development of thermal management technologies. In order to accommodate future heat fluxes as high as 1.0 MW/m2 from future microprocessors, the present study developed a novel cooling solution with essential attributes of compactness, low-cost, high cooling capacity, low power consumption, and orientation-free design. To achieve these, the mechanism of phase change was utilized. Fundamental boiling experiments were conducted on finned and porous surfaces using water as the working fluid. Significant insights in enhanced boiling heat transfer at near vacuum pressures were gathered. High speed visualization further confirmed the results by qualitative analysis of bubble nucleation, growth, coalescence, and departure at various operating conditions and boiling surfaces.
Appears in Collections:Ph.D Theses (Open)

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