Please use this identifier to cite or link to this item:
Title: Effects of prolonged annealing on NiSi at low temperature (500°C)
Authors: Anisur, M.R.
Osipowicz, T. 
Chi, D.Z.
Wang, W.D.
Keywords: Agglomeration
Interface roughness
Nickel monosilicide (NiSi)
Prolonged annealing
Thermal stability
Issue Date: Aug-2005
Citation: Anisur, M.R.,Osipowicz, T.,Chi, D.Z.,Wang, W.D. (2005-08). Effects of prolonged annealing on NiSi at low temperature (500°C). Journal of Electronic Materials 34 (8) : 1110-1114. ScholarBank@NUS Repository.
Abstract: The effects of prolonged annealing (10 h) at low temperature (500°C) have been studied in 20-nm Ni/Si (100) thin films using Rutherford backscattering spectroscopy (RBS), x-ray diffraction (XRD), scanning electron microscopy (SEM) in conjunction with energy-dispersive spectrometry (EDS), and four-point probe techniques. We observe that nickel monosilicide (NiSi) is stable up to 4 h annealing at 500°C. It is also found that, after 6 h and 10 h annealing, severe agglomeration sets in and NiSi thin films tear off and separate into different clusters of regions of NiSi and Si on the surface. Due to this severe agglomeration and tearing off of the NiSi films, sheet resistance is increased by a factor of 2 despite the fact that no NiSi to NiSi 2 transition occurs. It is also observed that, with increasing annealing time, the interface between NiSi and Si becomes rougher.
Source Title: Journal of Electronic Materials
ISSN: 03615235
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

checked on Mar 29, 2020

Google ScholarTM


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.