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Title: Drop impact: Fundamentals & impact characterisation of solder joints
Authors: Wong, E.H.
Rajoo, R.
Mai, Y.W.
Seah, S.K.W. 
Tsai, K.T.
Yap, L.M.
Issue Date: 2005
Citation: Wong, E.H.,Rajoo, R.,Mai, Y.W.,Seah, S.K.W.,Tsai, K.T.,Yap, L.M. (2005). Drop impact: Fundamentals & impact characterisation of solder joints. Proceedings - Electronic Components and Technology Conference 2 : 1202-1209. ScholarBank@NUS Repository.
Abstract: This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application. © 2005 IEEE.
Source Title: Proceedings - Electronic Components and Technology Conference
ISSN: 05695503
Appears in Collections:Staff Publications

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