Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/85928
DC FieldValue
dc.titleDrop impact: Fundamentals & impact characterisation of solder joints
dc.contributor.authorWong, E.H.
dc.contributor.authorRajoo, R.
dc.contributor.authorMai, Y.W.
dc.contributor.authorSeah, S.K.W.
dc.contributor.authorTsai, K.T.
dc.contributor.authorYap, L.M.
dc.date.accessioned2014-10-07T09:13:50Z
dc.date.available2014-10-07T09:13:50Z
dc.date.issued2005
dc.identifier.citationWong, E.H.,Rajoo, R.,Mai, Y.W.,Seah, S.K.W.,Tsai, K.T.,Yap, L.M. (2005). Drop impact: Fundamentals & impact characterisation of solder joints. Proceedings - Electronic Components and Technology Conference 2 : 1202-1209. ScholarBank@NUS Repository.
dc.identifier.issn05695503
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/85928
dc.description.abstractThis paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application. © 2005 IEEE.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleProceedings - Electronic Components and Technology Conference
dc.description.volume2
dc.description.page1202-1209
dc.description.codenPECCA
dc.identifier.isiutNOT_IN_WOS
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