Please use this identifier to cite or link to this item:
|Title:||Process and material behavior modeling for a new design of micro-additive fused deposition||Authors:||Monzón, M.D.
|Keywords:||Fused deposition modeling
Melted extrusion modeling
|Issue Date:||2013||Citation:||Monzón, M.D., Gibson, I., Benítez, A.N., Lorenzo, L., Hernández, P.M., Marrero, M.D. (2013). Process and material behavior modeling for a new design of micro-additive fused deposition. International Journal of Advanced Manufacturing Technology 67 (9-12) : 2717-2726. ScholarBank@NUS Repository. https://doi.org/10.1007/s00170-012-4686-y||Abstract:||The aim of this paper is to explore the limits and special requirements for additive manufacturing using polymer extrusion with a nozzle diameter much smaller than the conventional one: 0.050 mm diameter. This work is focused on the nozzle design and analyzes the effect of such a reduced diameter on the extrusion process and on the cooling of material while being deposited on the part. The approach is based on experimental and theoretical studies starting from conventional fused deposition modeling technology where the study tested swelling and cooling of filament material during deposition. Experimental work was used to assess the validity of the theoretical model and the first normal stress equation which estimated a swelling factor (diameter) of 1.249 at 0.087 g/h mass rate. The convection coefficient (h) on the plastic part was estimated as7 W/m2 K on the first deposited layer; considerably lower than some references show. © 2013 Springer-Verlag London.||Source Title:||International Journal of Advanced Manufacturing Technology||URI:||http://scholarbank.nus.edu.sg/handle/10635/85575||ISSN:||02683768||DOI:||10.1007/s00170-012-4686-y|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Oct 16, 2019
WEB OF SCIENCETM
checked on Oct 8, 2019
checked on Oct 12, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.