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Title: Tackling the drop impact reliability of electronic packaging
Authors: Wong, E.H.
Lim, C.T. 
Field, J.E.
Tan, V.B.C. 
Shim, V.P.W. 
Lim, K.M. 
Seah, S.K.W. 
Issue Date: 2003
Citation: Wong, E.H.,Lim, C.T.,Field, J.E.,Tan, V.B.C.,Shim, V.P.W.,Lim, K.M.,Seah, S.K.W. (2003). Tackling the drop impact reliability of electronic packaging. Advances in Electronic Packaging 1 : 757-763. ScholarBank@NUS Repository.
Abstract: A 3-year collaboration program between the Institute of Microelectronics, National University of Singapore, and the University of Cambridge has been established with the following two objectives: (i) to establish a mechanics and physics-of-failure based board-level test methodology; (ii) to establish design guidelines and, ultimately, failure criteria for board level interconnect during drop/impact test. The following accomplishments have been achieved in the first year of the program: (i) the mechanics and physics of failure in a typical board-level test have been established (ii) the drop impact characteristics of 6 commercial portable products have been comprehensively surveyed; (iii) a weakness has been identified in the drop impact strength of SnAgCu solder alloy (acknowledged as the leading Pb-free solder candidate).
Source Title: Advances in Electronic Packaging
ISBN: 0791836908
Appears in Collections:Staff Publications

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