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dc.titleTackling the drop impact reliability of electronic packaging
dc.contributor.authorWong, E.H.
dc.contributor.authorLim, C.T.
dc.contributor.authorField, J.E.
dc.contributor.authorTan, V.B.C.
dc.contributor.authorShim, V.P.W.
dc.contributor.authorLim, K.M.
dc.contributor.authorSeah, S.K.W.
dc.identifier.citationWong, E.H.,Lim, C.T.,Field, J.E.,Tan, V.B.C.,Shim, V.P.W.,Lim, K.M.,Seah, S.K.W. (2003). Tackling the drop impact reliability of electronic packaging. Advances in Electronic Packaging 1 : 757-763. ScholarBank@NUS Repository.
dc.description.abstractA 3-year collaboration program between the Institute of Microelectronics, National University of Singapore, and the University of Cambridge has been established with the following two objectives: (i) to establish a mechanics and physics-of-failure based board-level test methodology; (ii) to establish design guidelines and, ultimately, failure criteria for board level interconnect during drop/impact test. The following accomplishments have been achieved in the first year of the program: (i) the mechanics and physics of failure in a typical board-level test have been established (ii) the drop impact characteristics of 6 commercial portable products have been comprehensively surveyed; (iii) a weakness has been identified in the drop impact strength of SnAgCu solder alloy (acknowledged as the leading Pb-free solder candidate).
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleAdvances in Electronic Packaging
Appears in Collections:Staff Publications

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