Drop impact reliability - A comprehensive summary

Abstract

This paper provides a comprehensive summary of research activities focusing on the reliability of board level interconnections in drop impact, covering experimental work together with analytical and numerical modeling studies. These activities involve investigating (i) the dynamics of the PCB in product level and board level drop impact; (ii) the failure drivers: inertia force, differential flexing, and knocking; (iii) the relations among the PCB flexural modes, PCB strain, and interconnection stress/strain; (iv) high-strain-rate material characteristics; and (v) failure models.