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|Title:||Drop impact reliability - A comprehensive summary|
|Source:||Wong, E.H.,Mai, Y.-W.,Seah, S.K.W.,Rajoo, R.,Lim, T.B.,Lim, C.T.,Field, J. (2006). Drop impact reliability - A comprehensive summary. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/HDP.2005.251399|
|Abstract:||This paper provides a comprehensive summary of research activities focusing on the reliability of board level interconnections in drop impact, covering experimental work together with analytical and numerical modeling studies. These activities involve investigating (i) the dynamics of the PCB in product level and board level drop impact; (ii) the failure drivers: inertia force, differential flexing, and knocking; (iii) the relations among the PCB flexural modes, PCB strain, and interconnection stress/strain; (iv) high-strain-rate material characteristics; and (v) failure models.|
|Source Title:||2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05|
|Appears in Collections:||Staff Publications|
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