Please use this identifier to cite or link to this item: https://doi.org/10.1109/HDP.2005.251399
Title: Drop impact reliability - A comprehensive summary
Authors: Wong, E.H.
Mai, Y.-W.
Seah, S.K.W. 
Rajoo, R.
Lim, T.B.
Lim, C.T. 
Field, J.
Issue Date: 2006
Source: Wong, E.H.,Mai, Y.-W.,Seah, S.K.W.,Rajoo, R.,Lim, T.B.,Lim, C.T.,Field, J. (2006). Drop impact reliability - A comprehensive summary. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/HDP.2005.251399
Abstract: This paper provides a comprehensive summary of research activities focusing on the reliability of board level interconnections in drop impact, covering experimental work together with analytical and numerical modeling studies. These activities involve investigating (i) the dynamics of the PCB in product level and board level drop impact; (ii) the failure drivers: inertia force, differential flexing, and knocking; (iii) the relations among the PCB flexural modes, PCB strain, and interconnection stress/strain; (iv) high-strain-rate material characteristics; and (v) failure models.
Source Title: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
URI: http://scholarbank.nus.edu.sg/handle/10635/73373
ISBN: 0780392930
DOI: 10.1109/HDP.2005.251399
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