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|Title:||Effect of some geometric and packaging process parameters on die metallization failure||Authors:||Tay, A.A.O.
|Issue Date:||1995||Citation:||Tay, A.A.O.,Ong, S.H.,Lim, Y.K. (1995). Effect of some geometric and packaging process parameters on die metallization failure. Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA : 21-26. ScholarBank@NUS Repository.||Abstract:||This paper describes an experimental and finite element study of the effect of some geometric and packaging process parameters on die metallization failure during temperature cycling. The geometric parameters studied include die size, die offset, voided die attach and metal-line width, while process parameters include molding temperature, molding pressure and moisture preconditioning. A test chip designed to detect passivation and interlayer dielectric cracking was used to determine the locations on the die where metallization failures occurred. Three-dimensional finite element analyses were performed to determine the stress distribution within the package during temperature cycling. A good correlation between areas of high stress and occurrence of metallization failures was obtained.||Source Title:||Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA||URI:||http://scholarbank.nus.edu.sg/handle/10635/72596|
|Appears in Collections:||Staff Publications|
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