Please use this identifier to cite or link to this item:
Title: Sub-100-nm current-perpendicular-to-plane sensor fabrication
Authors: Zheng, Y.K.
Li, K.B.
Qiu, J.J.
Han, G.C.
Guo, Z.B.
Zong, B.Y.
An, L.H.
Luo, P.
Liu, Z.Y.
Wu, Y.H. 
Keywords: Current-perpendicular-to-plane (CPP)
Giant magnetoresistance (GMR) effect
Probe recording
Spin-valve (SV)
Issue Date: Jul-2004
Citation: Zheng, Y.K., Li, K.B., Qiu, J.J., Han, G.C., Guo, Z.B., Zong, B.Y., An, L.H., Luo, P., Liu, Z.Y., Wu, Y.H. (2004-07). Sub-100-nm current-perpendicular-to-plane sensor fabrication. IEEE Transactions on Magnetics 40 (4 II) : 2248-2250. ScholarBank@NUS Repository.
Abstract: Two sets of processes for sub-100-nm current-perpendicular-to-plane (CPP) spin-valves (SVs) were developed. In the first method, a CPP SV was fabricated by using via-hole instead of small cell patterning. This method makes it easy to characterize the CPP spin valve films. The shunting effect has been analyzed in this method. In the second method, a resist layer for planarization, ionmilling, and wet etching for self-opening vla-hole in a self-aligned fashion by making use of the height difference between the cell and surrounding regions was introduced. This method is suitable for the actual recording heads with small dimension even without an ion-beam-deposition system. CPP sensors with size from 0.05 μm 0.05 μm to 0.4 μm · 0.5μm with different free-layer structures have been investigated by means of the first method.
Source Title: IEEE Transactions on Magnetics
ISSN: 00189464
DOI: 10.1109/TMAG.2004.830204
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.


checked on Dec 7, 2022


checked on Dec 7, 2022

Page view(s)

checked on Dec 8, 2022

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.