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|Title:||PEEC model for multiconductor systems including dielectric mesh||Authors:||Jayabalan, J.
Wafer level package test
|Issue Date:||2005||Citation:||Jayabalan, J.,Ooi, B.L.,Irene, A.,Leong, M.S.,Iyer, M.K. (2005). PEEC model for multiconductor systems including dielectric mesh. Asia-Pacific Microwave Conference Proceedings, APMC 2 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/APMC.2005.1606378||Abstract:||In this paper, an elastomer dielectric mesh with and without metallization is modeled by the partial element equivalent circuit (PEEC) method. The model is verified through frequency domain measurements on a coplanar transmission structure sample. Due to good electrical contactability and mechanical compliance, this material has novel applications for fine pitch wafer level device testing at multi-gigahertz frequencies. © 2005 IEEE.||Source Title:||Asia-Pacific Microwave Conference Proceedings, APMC||URI:||http://scholarbank.nus.edu.sg/handle/10635/71381||ISBN:||078039433X||DOI:||10.1109/APMC.2005.1606378|
|Appears in Collections:||Staff Publications|
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