Please use this identifier to cite or link to this item:
https://doi.org/10.1109/APMC.2005.1606378
| Title: | PEEC model for multiconductor systems including dielectric mesh | Authors: | Jayabalan, J. Ooi, B.L. Irene, A. Leong, M.S. Iyer, M.K. |
Keywords: | Dielectric mesh PEEC Wafer level package test |
Issue Date: | 2005 | Citation: | Jayabalan, J.,Ooi, B.L.,Irene, A.,Leong, M.S.,Iyer, M.K. (2005). PEEC model for multiconductor systems including dielectric mesh. Asia-Pacific Microwave Conference Proceedings, APMC 2 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/APMC.2005.1606378 | Abstract: | In this paper, an elastomer dielectric mesh with and without metallization is modeled by the partial element equivalent circuit (PEEC) method. The model is verified through frequency domain measurements on a coplanar transmission structure sample. Due to good electrical contactability and mechanical compliance, this material has novel applications for fine pitch wafer level device testing at multi-gigahertz frequencies. © 2005 IEEE. | Source Title: | Asia-Pacific Microwave Conference Proceedings, APMC | URI: | http://scholarbank.nus.edu.sg/handle/10635/71381 | ISBN: | 078039433X | DOI: | 10.1109/APMC.2005.1606378 |
| Appears in Collections: | Staff Publications |
Show full item record
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.