Please use this identifier to cite or link to this item:
|Title:||PEEC model for multiconductor systems including dielectric mesh||Authors:||Jayabalan, J.
Wafer level package test
|Issue Date:||2005||Citation:||Jayabalan, J.,Ooi, B.L.,Irene, A.,Leong, M.S.,Iyer, M.K. (2005). PEEC model for multiconductor systems including dielectric mesh. Asia-Pacific Microwave Conference Proceedings, APMC 2 : -. ScholarBank@NUS Repository. https://doi.org/10.1109/APMC.2005.1606378||Abstract:||In this paper, an elastomer dielectric mesh with and without metallization is modeled by the partial element equivalent circuit (PEEC) method. The model is verified through frequency domain measurements on a coplanar transmission structure sample. Due to good electrical contactability and mechanical compliance, this material has novel applications for fine pitch wafer level device testing at multi-gigahertz frequencies. © 2005 IEEE.||Source Title:||Asia-Pacific Microwave Conference Proceedings, APMC||URI:||http://scholarbank.nus.edu.sg/handle/10635/71381||ISBN:||078039433X||DOI:||10.1109/APMC.2005.1606378|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jun 16, 2019
checked on Jun 14, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.