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Title: PEEC model for multiconductor systems including dielectric mesh
Authors: Jayabalan, J. 
Ooi, B.L. 
Irene, A.
Leong, M.S. 
Iyer, M.K.
Keywords: Dielectric mesh
Wafer level package test
Issue Date: 2005
Citation: Jayabalan, J.,Ooi, B.L.,Irene, A.,Leong, M.S.,Iyer, M.K. (2005). PEEC model for multiconductor systems including dielectric mesh. Asia-Pacific Microwave Conference Proceedings, APMC 2 : -. ScholarBank@NUS Repository.
Abstract: In this paper, an elastomer dielectric mesh with and without metallization is modeled by the partial element equivalent circuit (PEEC) method. The model is verified through frequency domain measurements on a coplanar transmission structure sample. Due to good electrical contactability and mechanical compliance, this material has novel applications for fine pitch wafer level device testing at multi-gigahertz frequencies. © 2005 IEEE.
Source Title: Asia-Pacific Microwave Conference Proceedings, APMC
ISBN: 078039433X
DOI: 10.1109/APMC.2005.1606378
Appears in Collections:Staff Publications

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